Delhi High Court Upholds Injunction over Mold-Tek’s Tamper-Evident Packaging Patents

The Delhi High Court has upheld an interim injunction restraining Neway Industries from infringing Mold-Tek Packaging Limited’s tamper-evident packaging patent IN’417 and revived interim protection for its second patent, IN’724.

The Court held that Neway failed to raise a credible validity challenge at the interim stage and that its products prima facie embodied the essential features of Mold-Tek’s patented inventions.

It clarified that once infringement is shown, the burden shifts to the defendant to meaningfully challenge validity, remanding the issue of IN’724’s validity for fresh consideration while restoring interim relief.

[Neway Industries Pvt. Ltd. v. Mold-Tek Packaging Ltd]